From 15–18 September 2026, Singapore hosted the inaugural Global Cooling Pledge Assembly, bringing together more than 230 representatives from governments, cities, industry, and international partners to accelerate action on heat resilience and sustainable cooling. The Assembly laid the groundwork for the Heat Resilience Roadmap for a Warming World, which aims to advance an integrated, multisectoral approach to addressing extreme heat and strengthening climate resilience.
Building on the COP31 Ministerial Roundtable on Delivering on the Global Cooling Pledge on 16 November 2026, this session will bring together ministers, city leaders, and partners to discuss priorities for advancing heat resilience and sustainable cooling. Discussions will focus on the development of the Heat Resilience Roadmap for a Warming World and the thematic action coalitions under the 2027–2028 Workplan, identifying opportunities to strengthen collaboration and translate shared commitments into concrete action.